Organic light-emitting display apparatus and method of manufacturing the same

ABSTRACT

An organic light-emitting display apparatus includes a flexible substrate having a display region and a non-display region located at an outer region of the display region, the non-display region being folded with respect to the display region; at least one organic light-emitting diode (OLED) on the display region of the flexible substrate; and an encapsulation member encapsulating the display region.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/608,930, filed May 30, 2017, which is a divisional of U.S. patentapplication Ser. No. 13/470,211, filed May 11, 2012, now U.S. Pat. No.9,668,318, which claims priority to and the benefit of Korean PatentApplication No. 10-2011-0095821, filed Sep. 22, 2011, the entire contentof both of which is incorporated herein by reference.

BACKGROUND 1. Field

The present invention relates to an organic light-emitting displayapparatus and a method of manufacturing the organic light-emittingdisplay apparatus.

2. Description of Related Art

An organic light-emitting display apparatus includes a hole injectionelectrode, an electron injection electrode, and an organic emittinglayer formed therebetween, and is a self-light-emitting displayapparatus in which holes injected from an anode and electrons injectedfrom a cathode are recombined in the organic emitting layer and thendisappear while emitting light.

The organic light-emitting display apparatus is expected to become anext generation display apparatus due to its high quality features suchas low power consumption, high brightness, and fast response speed.

The organic light-emitting display apparatus includes a display regionfor displaying an image, and a non-display region including variouscircuits and wirings for supplying an image signal to the displayregion. The non-display region is formed at an outer region of thedisplay region and is disposed on the same level as the display region.

Recently, there is an increasing demand for high display quality andvarious applications with respect to organic light-emitting displayapparatuses or large organic light-emitting display apparatuses, so thatthe number of circuits and wirings disposed in the non-display region isreduced.

SUMMARY

Exemplary embodiments according to the present invention provide anorganic light-emitting display apparatus that has a non-display regionhaving a foldable structure, so that a design margin with respect to adead space may be assured by allowing the non-display region to have aregion that is as large as a foldable region, and an aesthetic sense maybe improved by significantly decreasing the size of the non-displayregion that is recognizable by a user.

According to an aspect of embodiments of the present invention, there isprovided an organic light-emitting display apparatus including aflexible substrate having a display region and a non-display regionlocated at an outer region of the display region, the non-display regionbeing folded with respect to the display region; at least one organiclight-emitting diode (OLED) on the display region of the flexiblesubstrate; and an encapsulation member encapsulating the display region.

The encapsulation member may include a thin film.

The thin film may have a plurality of thin films that include at leastone of an organic thin film or an inorganic thin film.

The non-display region may be folded to cover at least a side surface ofthe thin film.

The encapsulation member may include an inflexible substrate, and theorganic light-emitting display apparatus may further include a sealantthat adheres the inflexible substrate and the flexible substratetogether. The sealant may surround the display region.

The inflexible substrate may include a glass substrate.

The sealant may include a glass frit.

The sealant may include an organic sealant.

The organic light-emitting display apparatus may further include asupporting substrate that supports the flexible substrate and is formedon a surface of the flexible substrate that is opposite to a surface onwhich the display region is formed.

The supporting substrate may include a glass substrate.

The size of the supporting substrate may be less than the size of theflexible substrate.

The non-display region may be folded to cover a side surface of thesupporting substrate.

The non-display region may be folded to cover a side surface of theencapsulation member.

The flexible substrate may include a plastic substrate.

The organic light-emitting display apparatus may further include abarrier layer that is formed on the flexible substrate and is formedbetween the display region and the non-display region.

The organic light-emitting display apparatus may further include anemitting unit including the at least one OLED, and a device/wiring layeron the flexible substrate and including a device and a wiring that areelectrically connected to the at least one OLED.

The organic light-emitting display apparatus may further include adriving circuit unit and a wiring unit at the non-display region,wherein the driving circuit and the wiring unit are electricallyconnected to the display region.

According to another aspect of the present invention, there is provideda method of manufacturing an organic light-emitting display apparatus,the method including (a) forming a flexible substrate on a supportingsubstrate, the flexible substrate having a display region and anon-display region at an outer region of the display region; (b) formingat least one organic light-emitting diode (OLED) on the display regionof the flexible substrate; (c) forming an encapsulation member on theflexible substrate to encapsulate the display region; (d) separating atleast a portion of the supporting substrate from the flexible substrate;and (e) folding the non-display region of the flexible substrate withrespect to the display region.

The forming (a) may include an operation of forming the flexiblesubstrate as a plastic substrate.

After the forming (a), the method may further include forming a barrierlayer on the flexible substrate.

The forming (c) may include an operation of forming the encapsulationmember as a thin film.

The thin film may be formed by stacking a plurality of thin films thatinclude at least one of an organic thin film or an inorganic thin film.

In the separating (d), the supporting substrate may be entirelyseparated from the flexible substrate, and in the folding (e), thenon-display region may be folded to cover a side surface of the thinfilm.

The forming (c) may include operations of forming the encapsulationmember as an inflexible substrate and adhering the inflexible substrateand the flexible substrate together by using a sealant.

The inflexible substrate may be formed as a glass substrate.

The sealant may include a glass frit.

The sealant may include an organic sealant.

In the separating (d), a region of the supporting substrate thatcorresponds to the non-display region may be separated from the flexiblesubstrate.

In the folding (e), the non-display region may be folded to cover a sidesurface of the supporting substrate.

In the folding (e), the non-display region may be folded to cover a sidesurface of the encapsulation member.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and aspects of the present invention willbecome more apparent by describing in detail exemplary embodimentsthereof with reference to the attached drawings in which:

FIG. 1 is a cross-sectional view of an organic light-emitting displayapparatus according to a first embodiment of the present invention;

FIG. 2 is a plan view illustrating a display region and a non-displayregion of the organic light-emitting display apparatus of FIG. 1 beforethe non-display region is folded;

FIG. 3 is a magnified cross-sectional view of a portion III of FIG. 2;

FIGS. 4A through 4F are cross-sectional views illustrating a method ofmanufacturing the organic light-emitting display apparatus according tothe first embodiment;

FIG. 5 is a cross-sectional view of an organic light-emitting displayapparatus according to a second embodiment of the present invention;

FIGS. 6A through 6F are cross-sectional views illustrating a method ofmanufacturing the organic light-emitting display apparatus according tothe second embodiment; and

FIG. 7 is a cross-sectional view of an organic light-emitting displayapparatus according to a third embodiment of the present invention.

DETAILED DESCRIPTION

Hereinafter, the present invention will be described in detail byexplaining exemplary embodiments of the invention with reference to theattached drawings.

Expressions such as “at least one of,” when preceding a list ofelements, modify the entire list of elements and do not modify theindividual elements of the list.

FIG. 1 is a cross-sectional view of an organic light-emitting displayapparatus 100 according to a first embodiment of the present invention.

Referring to FIG. 1, the organic light-emitting display apparatus 100includes a flexible substrate 120, a display region D disposed on theflexible substrate 120, a non-display region N folded with respect tothe display region D, and a thin film 150 encapsulating the displayregion D.

The flexible substrate 120 may be formed of a plastic material such aspolyethylene naphthalate, polyethylene terephthalate, polycarbonate,polyarylate, polyetherimide, polyethersulfone, polyimide, or the like,which has excellent heat-resistance and durability. However, a materialof the flexible substrate 120 is not limited thereto, and the flexiblesubstrate 120 may be formed of one of various flexible materials.

The flexible substrate 120 may be divided into a portion 120-Dcorresponding to the display region D that displays an image, and aportion 120-N corresponding to the non-display region N that is disposedat an outer region of the display region D. As will be described below,the portion 120-N of the flexible substrate 120, which corresponds tothe non-display region N, and a device/wiring layer 130 have foldedstructures to cover a side surface of the thin film 150.

Although not illustrated in FIG. 1, a barrier layer (not shown) may befurther arranged on the flexible substrate 120. The barrier layer may beformed of at least one of the group consisting of inorganic layers andorganic layers. The barrier layer may prevent an unnecessary (e.g.,undesirable) component from passing through the flexible substrate 120and then penetrating into the display region D.

The device/wiring layer 130 may be formed on the flexible substrate 120.

The device/wiring layer 130 may be divided into a portion 130-Dcorresponding to the display region D, and a portion 130-N correspondingto the non-display region N at the outer region of the display region D.

The portion 130-D of the device/wiring layer 130, which corresponds tothe display region D, may include a driving thin-film transistor (TFT)(e.g., refer to FIG. 3) for driving an organic light-emitting diode(OLED) (e.g., refer to FIG. 3) to be described below, a switching TFT(not shown), a capacitor, and wirings (not shown) that are connected tothe driving TFT, the switching TFT, or the capacitor.

The portion 130-N of the device/wiring layer 130, which corresponds tothe non-display region N, may include various circuits, wirings, padelectrodes, or the like, which drive an OLED of an emitting unit 140disposed in the display region D, and supply an image signal. Theportion 130-N of the device/wiring layer 130, which corresponds to thenon-display region N, and the portion 120-N of the flexible substrate120, which corresponds to the non-display region N, are folded to coverthe side surface of the thin film 150.

Since the organic light-emitting display apparatus 100 has a structurein which the non-display region N is folded with respect to the displayregion D, when a user sees the organic light-emitting display apparatus100 in front of the emitting unit 140 that is the display region D, awidth WN of the non-display region N, which is actually seen by theuser, is decreased, compared to a width WN₀ (e.g., refer to FIG. 2) ofthe non-display region N before being folded. Thus, the user may noticethat a border formed between the display region D and the non-displayregion N is significantly decreased.

Since the non-display region N does not produce an image, thenon-display region N may be referred to as a dead space of a displayapparatus. In order to decrease the dead space, the number of variouscircuits and wirings disposed in the non-display region N may bereduced, and/or a line width of the circuits and wirings may bedecreased. In the present embodiment, the number of various circuits,wirings, and/or pad electrodes formed in the portion 130-N of thedevice/wiring layer 130, which corresponds to the non-display region N,may be reduced, and/or a line width of the circuits, wirings and/or padelectrodes, may be decreased. However, due to a recent demand for highdisplay quality and various applications with respect to organiclight-emitting display apparatuses or large organic light-emittingdisplay apparatuses, it is difficult to reduce the number of circuitsand wirings and/or to decrease the line width in a manufacturingprocess. However, in the organic light-emitting display apparatus 100,the portion 130-N of the device/wiring layer 130, which corresponds tothe non-display region N, is folded so that it is possible to create aneffect in which the dead space is decreased. Thus, it is possible toassure a sufficiently large manufacturing margin with respect to thedead space before the non-display region N is folded, so that it may notbe necessary to reduce the number of circuits or wirings or to decreasethe line width (Effect 2).

The emitting unit 140 corresponding to the display region D is formed onthe device/wiring layer 130. The emitting unit 140 includes at least oneOLED (e.g., refer to FIG. 2).

The thin film 150 that encapsulates the display region D is formed onthe emitting unit 140. Although not illustrated in FIG. 1, the thin film150 may have a structure in which a plurality of inorganic layers areformed or inorganic layers and organic layers are alternately stacked.

If the thin film 150 encapsulates the organic light-emitting displayapparatus 100, impurities such as moisture and oxygen that can reduce alifetime of an OLED may easily penetrate into the emitting unit 140through the side surface of the thin film 150. However, in the organiclight-emitting display apparatus 100 according to the presentembodiment, the portion 130-N of the device/wiring layer 130, whichcorresponds to the non-display region N, and the flexible substrate 120are folded to cover the side surface of the thin film 150, so that it ispossible to prevent or reduce the penetration of the impurities throughthe side surface of the thin film 150. Thus, a lifetime of the organiclight-emitting display apparatus 100 may be extended (Effect 3).

FIG. 2 is a plan view illustrating the display region D and thenon-display region N of FIG. 1 before the non-display region N isfolded.

Referring to FIG. 2, an electrode power supply line 131 for supplyingpower to an opposite electrode 143 (e.g., refer to FIG. 3) that is acommon electrode, and its terminal 132 are disposed in the portion 130-Nof the device/wiring layer 130, which corresponds to the non-displayregion N. Also, a scanning circuit unit 133 for delivering a drivingsignal to the display region D, and its terminal 134 are disposed in theportion 130-N of the device/wiring layer 130, which corresponds to thenon-display region N. Also, a data circuit unit 135 for delivering adata signal to the display region D, and its terminal 136 are disposedin the portion 130-N of the device/wiring layer 130, which correspondsto the non-display region N. Also, a pad portion P, in which theterminals 132, 134, 136, and 138 are disposed, is formed in the portion130-N of the device/wiring layer 130, which corresponds to thenon-display region N. The circuits, wirings, and terminals shown in FIG.2 are exemplarily configured on the portion 130-N of the device/wiringlayer 130, which corresponds to the non-display region N. That is, insome embodiments, the circuits, wirings, and terminals may have adifferent configuration than that of FIG. 2.

As illustrated in FIG. 2, a sufficient width WN₀ of the dead space isassured in upper, lower, left, and right regions of the display region Dbefore the portion 130-N of the device/wiring layer 130, whichcorresponds to the non-display region N, is folded, so that it is notnecessary to reduce the number of circuits or wirings or to decrease aline width.

FIG. 3 is a magnified cross-sectional view of a portion III of FIG. 2.Referring to FIG. 3, at least one OLED is formed in the emitting unit140 of the display region D.

The OLED includes a pixel electrode 141, an organic emitting layer 142formed on the pixel electrode 141, and the opposite electrode 143 as thecommon electrode formed on the organic emitting layer 142.

The pixel electrode 141 may be a positive (+) electrode that is a holeinjection electrode, and the opposite electrode 143 that is the commonelectrode may be a negative (−) electrode that is an electron injectionelectrode. However, one or more embodiments of the present invention arenot limited thereto, and according to a driving method of the organiclight-emitting display apparatus 100, the pixel electrode 141 may be anegative electrode, and the common electrode 143 may be a positiveelectrode. Holes and electrons are injected into the organic emittinglayer 142 from the pixel electrode 141 and the opposite electrode 143,respectively. When excitons formed by combining the injected holes andelectrons drop from an excited state to a ground state, emission occurs.

The pixel electrode 141 is electrically connected to the driving TFTformed at the device/wiring layer 130 on the flexible substrate 120.Although FIG. 3 illustrates a TFT having a top gate structure, one ormore embodiments of the present invention are not limited thereto, and aTFT having one of various structures including a bottom gate structuremay be used.

Also, although FIG. 3 illustrates a structure in which the OLED isformed on the device/wiring layer 130 in which the driving TFT isformed, one or more embodiments of the present invention are not limitedthereto. For example, the structure may be variously changed into astructure in which the pixel electrode 141 of the OLED is formed at thesame level as an active layer 130-1 of the driving TFT, a structure inwhich the pixel electrode 141 is formed at the same level as a gateelectrode 130-3 of the driving TFT, a structure in which the pixelelectrode 141 is formed at the same level as a source electrode 130-5 aand a drain electrode 130-5 b, or the like.

Although FIG. 3 illustrates only the driving TFT that is electricallyconnected to the OLED, one or more embodiments of the present inventionare not limited thereto. Further, at least one switching TFT (not shown)and a storage capacitor (not shown) may be electrically connected to theOLED.

Light emitted from the organic emitting layer 142 may be emitted towardthe flexible substrate 120 or the thin film 150. The present embodimentwill now be described with reference to a bottom-emission type displayapparatus in which an image is realized toward the flexible substrate120. However, one or more embodiments of the present invention are notlimited thereto, and the organic light-emitting display apparatus 100may be a top-emission type display apparatus or a dual-emission typedisplay apparatus in which an image is realized toward the thin film150.

As in the present embodiment, in a case where the organic light-emittingdisplay apparatus 100 is a bottom-emission type display apparatus inwhich an image is realized toward the flexible substrate 120, thenon-display region N may be formed larger than that shown in FIG. 1. Forexample, the non-display region N may extend not only on the sidesurface of the thin film 150, but also may extend on a top surface ofthe thin film 150. Referring to FIG. 1, the non-display region N coversa portion of the top surface of the thin film 150. However, in a case ofthe bottom-emission type display apparatus, the non-display region N mayfurther extend on a region overlapping with the display region D on thetop side of the thin film 150. Thus, the manufacturing margin withrespect to the dead space may be further assured. However, in a case ofthe top-emission type display apparatus in which an image is realizedtoward the thin film 150, the non-display region N may not overlap withthe display region D, as shown in FIG. 1.

Although not illustrated, a protective film (not shown) may be furtherformed on each outer region of the flexible substrate 120 and the thinfilm 150. The protective film may improve the mechanical strength of theorganic light-emitting display apparatus 100. Also, the protective filmmay have a polarizing function.

Hereinafter, a method of manufacturing the organic light-emittingdisplay apparatus 100 according to the first embodiment will now bedescribed.

FIGS. 4A through 4F are cross-sectional views illustrating the method ofmanufacturing the organic light-emitting display apparatus 100 accordingto the first embodiment.

Referring to FIG. 4A, first, a supporting substrate 110 is arranged. Thesupporting substrate 110 may be a glass substrate but is not limitedthereto. The supporting substrate 110 may be formed of not only a glasssubstrate, but may also be formed of one of various substrates capableof supporting the flexible substrate 120 and enduring a manufacturingstress while the device/wiring layer 130, the emitting unit 140, and thethin film 150 are formed on the flexible substrate 120.

Referring to FIG. 4B, the flexible substrate 120 is formed on thesupporting substrate 110. As described above, the flexible substrate 120may be formed of a plastic material that has excellent heat-resistanceand durability. Although not illustrated in FIG. 4B, a barrier layer(not shown) may be further formed on the flexible substrate 120.

Referring to FIG. 4C, the flexible substrate 120 has the display regionD and the non-display region N. In more detail, the display region D mayinclude the emitting unit 140 in which the OLED is formed (refer to FIG.2), and a portion 130-D of the device/wiring layer 130, whichcorresponds to the emitting unit 140. Also, the non-display region N mayinclude an outer region of the device/wiring layer 130 with respect tothe emitting unit 140, that is, a portion 130-N that corresponds to thenon-display region N. As described above, the emitting unit 140 may beformed on the device/wiring layer 130 or may be formed at the same levelas the device/wiring layer 130.

Referring to FIG. 4D, the thin film 150 is formed to cover the emittingunit 140. The thin film 150 may be formed on the emitting unit 140 byusing one of various methods including a vacuum deposition method, amethod using an adhesive, or the like. Although not illustrated in FIG.4D, a protective film may be further adhered on the thin film 150.

Referring to FIG. 4E, the supporting substrate 110 is separated from theflexible substrate 120. Although not illustrated in FIG. 4E, after thesupporting substrate 110 is separated from the flexible substrate 120, aprotective film (not shown) may be further adhered on the flexiblesubstrate 120.

Referring to FIG. 4F, the portion 120-N of the flexible substrate 120,which corresponds to the non-display region N, and the portion 130-N ofthe device/wiring layer 130, which corresponds to the non-display regionN, are folded with respect to the display region D. In more detail, byfolding the portions 120-N and 130-N so as to sufficiently cover theside surface of the thin film 150, penetration of moisture and oxygenthrough the side surface of the thin film 150 is prevented or reduced.Here, an adhesive is arranged at a contact interface between the thinfilm 150 and the portion 130-N of the device/wiring layer 130, whichcorresponds to the non-display region N, so that the thin film 150 andthe portion 130-N of the device/wiring layer 130, which corresponds tothe non-display region N, may be firmly adhered together.

Hereinafter, a second embodiment of the present invention will now bedescribed. FIG. 5 is a cross-sectional view of an organic light-emittingdisplay apparatus 200 according to the second embodiment of the presentinvention.

Referring to FIG. 5, the organic light-emitting display apparatus 200includes a supporting substrate 210, a flexible substrate 220, a displayregion D above the flexible substrate 220, a non-display region N foldedwith respect to the display region D, an encapsulation substrate 250encapsulating the display region D, and a sealant 260 adhering theflexible substrate 220 and the encapsulation substrate 250 together.

The organic light-emitting display apparatus 200 is different from theorganic light-emitting display apparatus 100 of the first embodiment inthat the supporting substrate 210 for supporting the flexible substrate220 is further formed on a surface of the flexible substrate 220, whichis opposite to a surface on which the display region D is formed. Also,the organic light-emitting display apparatus 200 is different from theorganic light-emitting display apparatus 100 of the first embodiment inthat an encapsulation member for encapsulating the display region D isnot the thin film 150, but is the encapsulation substrate 250 that is aninflexible substrate such as a glass substrate, and the encapsulationsubstrate 250 is adhered to the flexible substrate 220 by using thesealant 260.

The supporting substrate 210 is formed of a material that has asufficient rigidity to support the flexible substrate 220 and that iscapable of enduring a manufacturing stress while a device/wiring layer230, an emitting unit 240, and the encapsulation substrate 250 areformed on the flexible substrate 220. For example, in the presentembodiment, a glass substrate is formed as the supporting substrate 210.

The size of the supporting substrate 210 is less than the size of theflexible substrate 220. The flexible substrate 220 may be divided into aportion 220-D corresponding to the display region D that displays animage, and a portion 220-N corresponding to the non-display region Nthat is disposed in an outer region of the display region D. The portion230-N of the device/wiring layer 230, which corresponds to thenon-display region N, and the portion 220-N of the flexible substrate220, which corresponds to the non-display region N, have foldedstructures to cover a side surface of the supporting substrate 210.

The emitting unit 240 corresponding to the display region D is formed onthe device/wiring layer 230. The emitting unit 240 includes at least oneOLED.

The encapsulation substrate 250 that is inflexible and that encapsulatesthe display region D is formed on the emitting unit 240. In the presentembodiment, the glass substrate being made of the same material as thesupporting substrate 210 is used as the encapsulation substrate 250.

The encapsulation substrate 250 and the flexible substrate 220 areadhered together by using the sealant 260. The sealant 260 may include aglass frit having an excellent water-permeation-prevention (or waterresistance) property, or may include one of various materials such as anorganic sealant, a moisture absorbent, or the like.

As described above, the organic light-emitting display apparatus 200according to the present embodiment has a structure in which thenon-display region N is folded with respect to the display region D.Therefore, when a user sees the organic light-emitting display apparatus200 in front of the emitting unit 240 that is the display region D, awidth WN of the non-display region N which is actually seen by the useris decreased, as compared to a width of the non-display region N beforebeing folded.

Thus, the user may notice that a border formed between the displayregion D and the non-display region N is significantly decreased.

Also, in the organic light-emitting display apparatus 200, the portion230-N of the device/wiring layer 230, which corresponds to thenon-display region N, is folded so that it is possible to create aneffect in which a dead space is decreased. Thus, it is possible toassure a sufficiently large manufacturing margin with respect to thedead space before the non-display region N is folded, so that it is notnecessary to reduce the number of circuits or wirings or to decrease aline width (Effect 2).

In addition, in the organic light-emitting display apparatus 200, thesupporting substrate 210 supports the flexible substrate 220 so thatshaking or vibration of the flexible substrate 220 may be stabilized orreduced while the organic light-emitting display apparatus 200 is movedor transported, and thus mechanical reliability of the organiclight-emitting display apparatus 200 may be increased.

Also, in the organic light-emitting display apparatus 200, instead ofusing a thin film, the inflexible encapsulation substrate 250 is adheredto the flexible substrate 220 by using the sealant 260, so that thepenetration of impurities through the side surface of the thin film maybe prevented. Thus, a lifetime of the organic light-emitting displayapparatus 200 may be extended.

In a case where the organic light-emitting display apparatus 200 is atop-emission type display apparatus in which an image is realized towardthe encapsulation substrate 250, the non-display region N may be formedlarger than that shown in FIG. 5. For example, the non-display region Nmay extend not only on the side surface of the supporting substrate 210,but also extend on a bottom surface of the supporting substrate 210.Referring to FIG. 5, the non-display region N covers a portion of thebottom surface of the supporting substrate 210. However, in a case of atop-emission type display apparatus, the non-display region N mayfurther extend on a region overlapping with the display region D.

Thus, the manufacturing margin with respect to the dead space may befurther assured. However, in a case of the top-emission type displayapparatus in which an image is realized toward the thin film 150, thenon-display region N may not overlap with the display region D, as shownin FIG. 1. Thus, a manufacturing margin with respect to the dead spacemay be further assured. However, in a case of a bottom-emission typedisplay apparatus in which an image is realized toward the supportingsubstrate 210, the non-display region N may not overlap with the displayregion D, as shown in FIG. 5.

Hereinafter, a method of manufacturing the organic light-emittingdisplay apparatus 200 according to the second embodiment will now bedescribed.

FIGS. 6A through 6F are cross-sectional views illustrating the method ofmanufacturing the organic light-emitting display apparatus 200 accordingto the second embodiment.

Referring to FIG. 6A, first, a supporting substrate 210-B is arranged.The size of the supporting substrate 210-B is greater than the size ofthe supporting substrate 210 of FIG. 5. Although the size of thesupporting substrate 210 of FIG. 5 is less than the size of the flexiblesubstrate 220, the size of the supporting substrate 210-B is equal to orgreater than the size of the flexible substrate 220.

Referring to FIG. 6B, the flexible substrate 220 is formed on thesupporting substrate 210-B. As described above, the flexible substrate220 may be formed of a plastic material that has excellentheat-resistance and durability. Although not illustrated in FIG. 6B, abarrier layer (not shown) may be further formed on the flexiblesubstrate 220.

Referring to FIG. 6C, the flexible substrate 220 has the display regionD and the non-display region N. In more detail, the display region D mayinclude the emitting unit 240 in which the OLED is formed, and a portion230-D of the device/wiring layer 230, which corresponds to the emittingunit 240. Also, the non-display region N may include a portion 230-N ofthe device/wiring layer 230, which corresponds to an outer region of theemitting unit 240.

Referring to FIG. 6D, the encapsulation substrate 250 is adhered to theflexible substrate 220 by using the sealant 260 so as to encapsulate theemitting unit 240. Although not illustrated in FIG. 6D, a protectivefilm may be further adhered on the encapsulation substrate 250.

Referring to FIG. 6E, a portion of the supporting substrate 210-B isseparated or removed from the flexible substrate 220. Here, a portion210 of the supporting substrate 210-B, which corresponds to the displayregion D, is not separated but remains on the flexible substrate 220,and a portion of the supporting substrate 210-B, which corresponds tothe non-display region N, is partly or entirely separated.

Here, one of various methods may be used to separate a portion of thesupporting substrate 210-B. FIG. 6E illustrates an example of thevarious methods in which a portion of the supporting substrate 210-B isseparated by cutting the supporting substrate 210-B with a cutter C. Theportion 210 that is not separated, but remains on the flexible substrate220, supports the flexible substrate 220, so that the mechanicalreliability of the organic light-emitting display apparatus 200 may beincreased.

Referring to FIG. 6F, the portion 220-N of the flexible substrate 220,which corresponds to the non-display region N, and the portion 230-N ofthe device/wiring layer 230, which corresponds to the non-display regionN, are folded with respect to the display region D. In more detail, asillustrated in FIG. 5, they are folded to cover at least the sidesurface of the supporting substrate 210.

Hereinafter, a third embodiment of the present invention will now bedescribed. FIG. 7 is a cross-sectional view of an organic light-emittingdisplay apparatus 300 according to the third embodiment of the presentinvention.

Hereinafter, the organic light-emitting display apparatus 300 accordingto the third embodiment will now be described with reference to adifference between the organic light-emitting display apparatus 200according to the second embodiment and the organic light-emittingdisplay apparatus 300 according to the third embodiment.

Referring to FIG. 7, the organic light-emitting display apparatus 300according to the third embodiment includes a supporting substrate 310, aflexible substrate 320, a display region D disposed above the flexiblesubstrate 320, a non-display region N folded with respect to the displayregion D, an encapsulation substrate 350 encapsulating the displayregion D, and a sealant 360 adhering the flexible substrate 320 and theencapsulation substrate 350 together.

The organic light-emitting display apparatus 300 has a structure inwhich a portion 320-N of the flexible substrate 320, which correspondsto the non-display region N, and a portion 330-N of a device/wiringlayer 330, which corresponds to the non-display region N, have foldedstructures to cover a side surface of the encapsulation substrate 350.Here, the sealant 360 is within the non-display region N. In a casewhere the sealant 360 is formed of glass frit that has weak resistanceto shock, since the non-display region N covers the glass frit, theshock on the glass frit may be lessened. Also, in a case where thesealant 360 is formed of an organic sealant that is susceptible to waterpermeation, since the non-display region N covers the organic sealant,the water permeation into the organic sealant may be prevented orreduced.

In a case where the organic light-emitting display apparatus 300 is abottom-emission type display apparatus in which an image is realizedtoward the flexible substrate 320, the non-display region N may beformed larger than that shown in FIG. 7. For example, the non-displayregion N may extend not only on the side surface of the encapsulationsubstrate 350 but also extend on a top surface of the encapsulationsubstrate 350. Referring to FIG. 7, the non-display region N covers aportion of a top surface of the encapsulation substrate 350. However, ina case of the bottom-emission type display apparatus, the non-displayregion N may further extend on a region overlapping with the displayregion D. Thus, a manufacturing margin with respect to a dead space maybe further assured. However, in a case of a top-emission type displayapparatus in which an image is realized toward the encapsulationsubstrate 350, the non-display region N may not overlap with the displayregion D, as shown in FIG. 7.

An organic light-emitting display apparatus according to the one or moreembodiments of the present invention provide the following effects:

First, since a non-display region is folded, a border of a displayregion by the non-display region, which is seen by a user, may besignificantly decreased.

Second, before the non-display region is folded, a manufacturing marginwith respect to a dead space may be sufficiently assured, so that it isnot necessary to reduce the number of circuits or wirings or to decreasea line width.

Third, in a case where an encapsulation member is formed as a thin film,the non-display region is folded to cover a side surface of the thinfilm, so that penetration of impurities through the side surface of thethin film may be prevented or reduced, and thus a lifetime of an organiclight-emitting display apparatus may be extended.

Fourth, in a case where the encapsulation member is formed as aninflexible encapsulation substrate, and the inflexible encapsulationsubstrate is adhered by using a sealant, a lifetime of the organiclight-emitting display apparatus may be extended, compared to a case ofusing the thin film.

Fifth, in a case where a flexible substrate is supported by a supportingsubstrate, shaking or vibration of the flexible substrate may bestabilized or reduced so that the mechanical reliability of the organiclight-emitting display apparatus may be increased.

In the drawings, the thicknesses or sizes of the elements of theembodiments of the present invention may be exaggerated for clarity, andthus should not be construed as shown in the drawings.

While the present invention has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the present invention as defined by the following claims andequivalents thereof.

What is claimed is:
 1. A display apparatus comprising: a supportingsubstrate; a flexible substrate on the supporting substrate andcomprising a display region and a non-display region adjacent to thedisplay region; an emitting unit on the flexible substrate; and anencapsulation member on the emitting unit, wherein the flexiblesubstrate is folded toward the supporting substrate at the non-displayregion.
 2. The display apparatus of claim 1, wherein the display regionand the non-display region are formed on the flexible substrate.
 3. Thedisplay apparatus of claim 1, wherein the encapsulation member comprisesan inflexible substrate, and the display apparatus further comprises asealant that adheres the inflexible substrate and the flexible substratetogether.
 4. The display apparatus of claim 3, wherein the sealantsurrounds the display region.
 5. The display apparatus of claim 3,wherein the inflexible substrate comprises a glass substrate.
 6. Thedisplay apparatus of claim 3, wherein the sealant comprises a glassfrit.
 7. The display apparatus of claim 3, wherein the sealant comprisesan organic material.
 8. The display apparatus of claim 1, wherein thesupporting substrate comprises a glass substrate.
 9. The displayapparatus of claim 1, wherein the size of the supporting substrate isless than the size of the flexible substrate in a plan view of thedisplay apparatus.
 10. The display apparatus of claim 1, wherein thesize of the supporting substrate is less than the size of the flexiblesubstrate in a cross-sectional view of the display apparatus.
 11. Thedisplay apparatus of claim 1, wherein the non-display region of theflexible substrate is folded to cover a side surface of the supportingsubstrate.
 12. The display apparatus of claim 11, wherein thenon-display region of the flexible substrate is folded to cover aportion of a bottom surface of the supporting substrate.
 13. The displayapparatus of claim 12, wherein the non-display region of the flexiblesubstrate overlaps with the portion of a bottom surface of thesupporting substrate.
 14. The display apparatus of claim 1, wherein theflexible substrate comprises a plastic material.
 15. The displayapparatus of claim 1, further comprising a barrier layer that is formedon the flexible substrate.
 16. The display apparatus of claim 1, whereinthe emitting unit comprises at least one OLED, and the display apparatusfurther comprises a device/wiring layer on the flexible substrate andcomprising a device and a wiring that are electrically connected to theat least one OLED.
 17. The display apparatus of claim 1, furthercomprising a driving circuit unit and a wiring unit at the non-displayregion, wherein the driving circuit unit and the wiring unit areelectrically connected to the emitting unit.
 18. The display apparatusof claim 1, wherein the size of the display region is less than the sizeof the supporting substrate in a plan view of the display apparatus. 19.The display apparatus of claim 1, wherein the size of the display regionis less than the size of the supporting substrate in a cross-sectionalview of the display apparatus.
 20. The display apparatus of claim 1,wherein an image emitted from the emitting unit is realized toward theencapsulation substrate.
 21. The display apparatus of claim 1, furthercomprising a wiring layer on the flexible substrate and comprising afirst portion and a second portion, wherein the first portioncorresponds to the non-display region and the second portion correspondsto the display region.
 22. The display apparatus of claim 21, whereinthe first portion of the wiring layer is folded toward the supportingsubstrate.
 23. The display apparatus of claim 22, wherein the firstportion of the wiring layer is folded to cover a side surface of thesupporting substrate.
 24. The display apparatus of claim 23, wherein thefirst portion of the wiring layer is folded to cover a bottom surface ofthe supporting substrate.
 25. The display apparatus of claim 24, whereinthe first portion of the wiring layer at least partially overlaps withthe bottom surface of the supporting substrate.
 26. The displayapparatus of claim 22, wherein wirings of the first portion of thewiring layer are electrically connected to a driving thin-filmtransistor of the emitting unit.
 27. The display apparatus of claim 1,further comprising a device layer on the flexible substrate andcomprising a first portion and a second portion, wherein the firstportion corresponds to the non-display region and the second portioncorresponds to the display region.
 28. The display apparatus of claim27, wherein the first portion of the device layer is folded toward thesupporting substrate.
 29. The display apparatus of claim 28, wherein thefirst portion of the device layer is folded to cover a side surface ofthe supporting substrate.
 30. The display apparatus of claim 29, whereinthe first portion of the device layer is folded to cover a bottomsurface of the supporting substrate.
 31. The display apparatus of claim27, wherein a driving circuit unit of the first portion of the devicelayer is electrically connected to the emitting unit.
 32. A displayapparatus comprising: a supporting substrate; a flexible substrate onthe supporting substrate and comprising a display region and anon-display region adjacent to the display region; an emitting unit onthe flexible substrate; a wiring layer on the flexible substrate andcomprising wirings on a portion corresponding to the non-display region,the wirings being electrically connected to the emitting unit; and anencapsulation member on the emitting unit, wherein the flexiblesubstrate is folded toward the supporting substrate at the non-displayregion.
 33. An organic light-emitting display apparatus comprising: asupporting substrate; a flexible substrate on the supporting substrateand comprising a display region and a non-display region adjacent to thedisplay region; an emitting unit comprising an organic light-emittingdiode (OLED) on the flexible substrate; a driving thin-film transistoron a portion corresponding to the display region and drives the OLED; awiring layer on the flexible substrate, the wiring layer comprisingwirings on a portion corresponding to the non-display region; and anencapsulation member on the emitting unit, wherein the flexiblesubstrate is folded toward the supporting substrate at the non-displayregion, and wherein the wirings are electrically connected to thedriving thin-film transistor.
 34. A method of manufacturing a displayapparatus, the method comprising: (a) forming a flexible substrate on asupporting substrate, the flexible substrate comprising a display regionand a non-display region adjacent to the display region; (b) forming anemitting unit on the flexible substrate; (c) forming an encapsulationmember on the flexible substrate to encapsulate the emitting unit; (d)separating a region of the supporting substrate corresponding to thenon-display region from the flexible substrate; and (e) folding theflexible substrate toward the supporting substrate at the non-displayregion.
 35. The method of claim 34, wherein (a) comprises forming theflexible substrate using a plastic material.
 36. The method of claim 34,further comprising, after (a), forming a barrier layer on the flexiblesubstrate.
 37. The method of claim 34, wherein (c) comprises forming theencapsulation member as an inflexible substrate, and adhering theinflexible substrate and the flexible substrate together by using asealant.
 38. The method of claim 37, wherein the inflexible substrate isformed as a glass substrate.
 39. The method of claim 37, wherein thesealant comprises a glass frit.
 40. The method of claim 37, wherein thesealant comprises an organic material.
 41. The method of claim 34,wherein, in (e), the non-display region is folded to cover a sidesurface of the supporting substrate.